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Magazine Name : Microelectronics Journal
Year : 2003Volume number : 34Issue:03
New Possibilities In The Thermal Evaluation, Offered By Transient Testing(Article) Subject:
Thermal Testing
,
Thermal Modeling
Author:
Marta
Rencz
page:
171
-
177
Thermal Challenges In Mems Applications: Phase Change Phenomena And Thermal Bonding Processes(Article) Subject:
Bubble Shape
,
Thermal Bonding
Author:
Liwei
Lin
page:
179
-
185
Innovative Wick Design For Multi-Source , Flat Plate Heat Pipes(Article) Subject:
Micro-Heat Pipe
,
Ic Cooling Technology
Author:
M.J.
Rightley
page:
187
-
194
Dynamic Of A Liquid Plug In A Cappillary Duct Powered By Vapor Explosion(Article) Subject:
Liquid Plug
Author:
Osamu
Suzuki
page:
195
-
200
Nonequilibirium Electron And Phonon Transport And Energy Conversion In Heterostructures(Article) Subject:
Heterostructure
Author:
Taofang
Zheng
page:
201
-
206
A Study Of Temperature Field In A Gan Heterostructure Field-Effect Transistor(Article) Subject:
Gallium Nitride
,
Heterostructure
Author:
Mirza B
Baig
page:
207
-
214
Performance And Testing Of Thermal Interface Materials(Article) Subject:
Thermal Interface Material
,
Thermal Interface Resistance
Author:
Santiranjan
R.
page:
215
-
222
Evaalution Of Analytical Models For Thermal Analysis And Design Of Elkectronic Packages(Article) Subject:
Orthotropic Material
Author:
S.
Moghaddam
page:
223
-
230